Source: The New York Times
The bottleneck isn't fabrication anymore—it's final assembly and packaging, where TSMC and its Taiwanese supplier ecosystem have become effectively irreplaceable for cutting-edge semiconductors. The US has invested heavily in fab capacity through CHIPS Act funding but lacks the specialized infrastructure and decades of supply chain integration that Taiwan commands. Even domestically manufactured chips still need to travel across the Pacific for finishing work. This creates a persistent vulnerability that reshoring efforts haven't solved: the ability to assemble a chip at scale with the precision required for advanced nodes remains concentrated in a region the US cannot easily duplicate.